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Parker Hannifin 65-02-GEL30-0600 THERM-A-GAP GEL 30 High Performance Gels

Introducing Parker Hannifin's 65-02-GEL30-0600 THERM-A-GAP GEL 30, a revolutionary high-performance, fully cured, dispensable gel designed to optimize thermal management in a variety of applications. This innovative product offers exceptional thermal conductivity of 3.5 W/m-K, ensuring efficient heat transfer and reducing the risk of overheating. With its ease of use and superior design flexibility, THERM-A-GAP GEL 30 is a game-changer for engineers and manufacturers seeking to enhance their thermal solutions. Key features include: high bulk thermal conductivity, low thermal impedance, and ultra-low compression force, making it an ideal choice for a wide range of applications.

Product Properties and Specifications

Parker Chomerics THERM-A-GAP™ Gel 30 is a single-component gel that requires no mixing or curing, providing unparalleled convenience and efficiency. This gel is fully cured and dispensable, eliminating the need for time-consuming hand assembly and reducing installation costs. Its high tack surface allows for easy reworkability, ensuring a seamless integration into your design process. Notable properties include: compatibility with common heat spreaders, proven reliability in extreme temperature cycling, and shock & vibration resistance. The gel accommodates various bond line thicknesses, making it suitable for applications across multiple devices. It is also compatible with high-volume, automated dispense processes and meets Telcordia (Bellcore) silicone specifications.

Typical Applications and Benefits

THERM-A-GAP GEL 30 is a versatile solution for a wide range of applications, including automotive electronic control units (ECUs), power supplies & semiconductors, memory & power modules, microprocessors, graphics, processors, and flat panel displays. Its exceptional thermal management capabilities make it an essential component for consumer electronics and industrial devices. By using THERM-A-GAP GEL 30, you can benefit from reduced component failures, improved system reliability, and a more efficient thermal solution. Target audience scenarios include: engineers and manufacturers in the automotive, electronics, and consumer electronics industries, looking to enhance their thermal management strategies and optimize their product performance.