Going Fast Mbga-ip 26 In 1 Bga Reballing Platform For Iphone 7 To 15 Pro Max Bundle [ovdtIhmn]

Mbga-IP 26 IN 1 BGA Reballing Platform

Introducing the Mbga-IP 26 IN 1 BGA Reballing Platform, a versatile and comprehensive solution for iPhone 7 to 15 Pro Max repairs. This all-in-one kit is designed to meet the demands of professional technicians and DIY enthusiasts alike. With its extensive compatibility and user-friendly features, the Mbga-IP platform stands out as a must-have tool for precise and efficient reballing and repair services.

Comprehensive Compatibility

The Mbga-IP platform is compatible with a wide range of iPhone models, from the iPhone 7 to the latest 15 Pro Max. This ensures that you can perform accurate reballing and repair services on a variety of devices. The platform includes a 26 in 1 BGA reballing stencil kit, which covers all the essential components such as WiFi, baseband, CPU, and NAND, making it an indispensable tool for any iPhone repair shop.

Advanced Features and Benefits

The Mbga-IP platform is equipped with cutting-edge features that enhance the reballing process. One of its standout features is the two-in-one design for tin planting and glue removal. This innovative design allows you to partially implant tin while removing glue, which effectively fixes the chip in place. Additionally, the platform includes various positioning plates and stencil kits to accommodate different iPhone models and component sizes, ensuring precise alignment and a successful repair every time. With the Mbga-IP platform, you can confidently take on the most challenging repair jobs and deliver high-quality results to your customers.