Breakout Star Used Pva Tepla 660 Diy Kit [hZrBVeMH]

Breakout Star Used Pva Tepla 660 Diy Kit [hZrBVeMH] Cleaning System

Introducing the PVA TEPLA 660 Microwave Plasma Cleaning System, a cutting-edge solution for advanced chip packaging cleaning. This system is designed to ensure precision and efficiency in the cleaning process, making it an ideal choice for various semiconductor applications. The core feature of the PVA TEPLA 660 is its electrode-free energy feeding, which allows for the processing of substrates in their original, unslotted magazines. This innovative approach minimizes damage and maximizes performance, setting it apart from conventional cleaning methods. Key benefits include fast and damage-free plasma processing, as well as ease of operation with manual and automatic loading and unloading options.

• Electrode-free energy feeding for substrate processing
• Fast and damage-free plasma processing
• Manual and automatic loading and unloading options

Product Specifications and Technical Details

The PVA TEPLA 660 Microwave Plasma Cleaning System boasts a chamber size of 15" x 15" x 15", equipped with a rotary vane vacuum pump for optimal performance. Operating at 2.45 GHz, the system utilizes microwaves to generate a largely extended plasma within the vacuum chamber, ensuring thorough cleaning. This system is versatile, capable of processing any size of magazine, whether slotted or unslotted. The downstream configuration for unslotted magazines and the rotating platform for slotted magazines make it adaptable to various packaging needs. Additionally, the system complies with semiconductor industry standards, ensuring reliability and compatibility.

• Chamber size: 15" x 15" x 15"
• Operating frequency: 2.45 GHz
• Compliance with semiconductor industry standards

Practical Applications and Target Audience

The PVA TEPLA 660 Microwave Plasma Cleaning System is designed for professionals in the semiconductor industry, particularly for those involved in die attach, wire bond, and encapsulation processes. Its ability to clean advanced chip packages efficiently and safely makes it a valuable asset in daily operations. The system's ease of use, combined with its advanced features, makes it suitable for both small-scale and large-scale production environments. Whether you are a semiconductor manufacturer or a researcher in the field, the PVA TEPLA 660 is a reliable tool that can enhance the quality and efficiency of your processes.

• Target audience: Semiconductor industry professionals
• Applications: Die attach, wire bond, and encapsulation processes
• Enhanced quality and efficiency in production